The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Mar. 25, 2016
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package may include a first semiconductor die, external connectors, second semiconductor dies, a mold layer, an outer packaging part, and a terrace-like edge. The external connectors may be disposed over a first surface of the first semiconductor die. The second semiconductor dies may be stacked over a second surface of the first semiconductor die. The mold layer may cover sidewalls of the second semiconductor dies. The outer packaging part may have a groove in which a stack structure of the first and second semiconductor dies are accommodated. The terrace-like edge may be disposed under an edge of the mold layer to expose a sidewall of the first semiconductor die. A portion of an outer sidewall of the mold layer may be in contact with a portion of an inner surface of the outer packaging part, and the inner surface of the outer packaging part may be spaced apart from the sidewall of the first semiconductor die by the terrace-like edge.