Walter H Schroen

Title: Walter H. Schroen: Innovator in Integrated Circuit Packaging

Introduction

Walter H. Schroen is a notable inventor based in Dallas, TX (US), recognized for his contributions to the field of integrated circuit packaging. With a total of 4 patents to his name, Schroen has made significant advancements in technology that enhance the efficiency and functionality of electronic devices.

Latest Patents

Among his latest innovations is a patent for wafer level packaging, which describes an integrated circuit package that includes an integrated circuit chip. This package features a lead frame positioned opposite the integrated circuit chip, with at least one lead electrically coupled to the integrated circuit by a connector. The design ensures that the lead remains within the periphery of the integrated circuit chip, while an encapsulant covers the integrated circuit, the connector, and a portion of the lead frame. A remaining portion of the lead frame is left exposed from the encapsulant, allowing for improved connectivity and performance.

Career Highlights

Walter H. Schroen has built a successful career at Texas Instruments Corporation, where he has been instrumental in developing innovative solutions in the electronics industry. His work has contributed to the advancement of integrated circuit technology, making significant impacts on product design and functionality.

Collaborations

Throughout his career, Schroen has collaborated with talented professionals, including Judith Sultenfuss Archer and Robert E. Terrill. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Walter H. Schroen's contributions to integrated circuit packaging exemplify the spirit of innovation in the technology sector. His patents and collaborations continue to influence the development of electronic devices, showcasing his commitment to advancing the field.