The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2001

Filed:

Dec. 02, 1999
Applicant:
Inventors:

Walter H. Schroen, Dallas, TX (US);

Judith S. Archer, Dallas, TX (US);

Robert E. Terrill, Houston, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/980 ;
U.S. Cl.
CPC ...
H01L 2/980 ;
Abstract

A structure and method for forming a hermetically sealed semiconductor chip having an active and a passive surface and four edge sides, each edge side having only a single plane; said active surface having an integrated circuit including multiple deposited layers and a plurality of contact pads, said contact pads having bondable and non-corrodible surface; said deposited layers having exposed portions at said side edges; a protective overcoat impermeable to moisture overlying said integrated circuit; and a continuous sealant layer impermeable to moisture overlying all area of said four side edges, whereby said edge sides are sealed and said chip is rendered hermetic. Positioning a plurality of said chips on a support in a deposition apparatus and preferably using chemical vapor deposition or sputtering techniques, a layer, or a sandwich of layers, of moisture-impermeable material is deposited on all edge sides simultaneously while preventing deposition of said material on at least portion of the exposed active or passive surfaces.


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