Nashua, NH, United States of America

Vysakh Sivarajan

This inventor holds 52 USPTO granted patents and 8 published patent applications, primarily in Electrical Connectors. Top assignee: Amphenol Corporation. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vysakh Sivarajan. Retrieved from https://idiyas.com/inventor/vysakh-sivarajan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 52 

% Patents Active = 96.2

Average Co-Inventor Count = 5.2

ph-index = 16

Forward Citations = 952(Granted Patents)

Forward Citations (Not Self Cited) = 683(Dec 10, 2025)


Company Filing History:


Years Active: 2016-2026

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Areas of Expertise:
Electrical Connector
High Speed Interconnection
Cable Termination
Shielded Signal Paths
High Density Connectors
Mating Backplane
Insulative Support
Compliant Shield
Low Loss Interconnection
Broadside Subassemblies
Edge to Broadside Transition
High Performance Connector
52 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Vysakh Sivarajan and His Contributions to Electrical Engineering

Introduction: Vysakh Sivarajan, based in Nashua, NH, has made significant strides in the field of electrical engineering as a prolific inventor. With a remarkable portfolio of 43 patents, his work continues to push the boundaries of innovation in high-speed and high-density electrical connectors.

Latest Patents: Among Sivarajan's latest inventions are two notable patents that demonstrate his expertise in developing advanced electrical connectivity solutions. The first patent is for a high-speed, high-density electrical connector featuring shielded signal paths. This modular electrical connector is designed with separately shielded signal conductor pairs, allowing for assembly from individual modules that contain pairs of signal conductors surrounded by conductive materials. These modules can be arranged into wafers of varying sizes, enhancing design flexibility. The inclusion of compliant members on the shielding members enables multiple points of contact, optimizing signal integrity.

The second patent is centered on a mating backplane for high-speed connectivity. It outlines a printed circuit board architecture that comprises various layers, including attachment and routing layers. Key features include differential signal pairs through signal vias and strategically placed ground vias, with shadow vias ensuring that the design remains free of conductive material in specific areas. This innovative structure not only facilitates high-speed data transmission but also optimizes performance through effective routing.

Career Highlights: Vysakh Sivarajan's career is marked by his association with Amphenol Corporation, where he has dedicated his talents to advancing electrical connectivity technology. His role at the company has allowed him to explore various facets of electrical engineering, leading to a prolific output of patents that address contemporary challenges in the industry.

Collaborations: Throughout his career, Sivarajan has collaborated with notable colleagues, enriching his work through shared expertise. His coworkers, Mark W. Gailus and Marc Benard Cartier, Jr., have joined him in exploring innovative solutions within the realm of electrical connectors, contributing to the successful development and patenting of a multitude of cutting-edge technologies.

Conclusion: Vysakh Sivarajan exemplifies the spirit of innovation in electrical engineering through his extensive patent portfolio. His latest inventions at Amphenol Corporation highlight his commitment to enhancing the capabilities of electrical connectors, making significant contributions to the field. As technology continues to evolve, Sivarajan's innovations will undoubtedly play a critical role in shaping the future of electrical connectivity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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