The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Dec. 09, 2022
Applicant:

Amphenol Corporation, Wallingford, CT (US);

Inventors:

Marc B. Cartier, Jr., Durham, NH (US);

John Robert Dunham, Windham, NH (US);

Mark W. Gailus, Concord, MA (US);

John Pitten, Merrimack, NH (US);

David Levine, Amherst, NH (US);

Vysakh Sivarajan, Nashua, NH (US);

Assignee:

Amphenol Corporation, Wallingford, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); H01R 12/70 (2011.01); H01R 13/08 (2006.01); H01R 13/6585 (2011.01);
U.S. Cl.
CPC ...
H01R 12/716 (2013.01); H01R 12/7047 (2013.01); H01R 13/08 (2013.01); H01R 13/6585 (2013.01);
Abstract

A dense, high-speed interconnection may be formed with a mating header and receptacle connector. The header connector may have groups of mating contact portions extending from the connector housing. Structural projections may extend from the housing adjacent some or all of the groups of mating contact portions. The groups of mating contact portions may be signal and ground mating contact portions associated with a signal pair. The groups may be arranged in an array and the structural projections may be arranged in an array intercalated with the array of the groups of mating contact portions. A receptacle connector may include an array of apertures configured to receive the structural projections. The structural projections may be shaped and positioned to reduce damage to the mating contact portions of the header connector, enable reliable manufacture, and to provide a high-density mating interface.


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