Vladimir Perelman

Title: Vladimir Perelman: Innovating Stackable Packages and Streamlining Manufacturing Processes

Introduction:

In the world of innovations and patents, Vladimir Perelman is a known name for his significant contributions in the field of stackable packaging solutions. Hailing from Fremont, California, Perelman has made remarkable advancements in the manufacturing processes, particularly in encapsulation operations. With a career spanning multiple companies and several patents under his belt, let's delve into his latest inventions, career highlights, collaborations, and the impact of his work.

Latest Patents:

Vladimir Perelman's most recent patents focus on the development of stackable packages and a method to manufacture them more efficiently. One of his notable patents is the "Stackable Package and Method," which presents a unique approach. During an encapsulation operation, a stackable package is placed within a mold. The compliant surface of the mold, typically made of a compliant film, compresses the upper interconnection balls of the package. This process forces the upper portions of the interconnection balls into the mold, while the lower portions remain exposed within the space between the compliant surface and the package's substrate. The resulting space is then filled with a dielectric material, forming the package body. One remarkable aspect of this invention is that it exposes the upper portions of the interconnection balls directly in a single encapsulation operation, eliminating the need for selective removal of the package body. This innovative approach reduces the number of manufacturing operations and overall costs associated with producing stackable packages.

Career Highlights:

Vladimir Perelman's career has been shaped by his association with prominent companies in the industry. He has made significant contributions to advanced packaging technologies throughout his professional journey. Some notable companies where he has worked include:

1. Amkor Technology, Inc: Perelman's involvement with Amkor Technology allowed him to contribute to the development of cutting-edge packaging solutions. Through his work, he has demonstrated a knack for innovative thinking and problem-solving in the packaging domain.

2. National Semiconductor Corporation: During his tenure at National Semiconductor Corporation, Perelman continued to push the boundaries of packaging technologies. His expertise in encapsulation operations and stackable packages has proven invaluable in advancing the field.

Collaborations:

Throughout his career, Vladimir Perelman has worked alongside talented individuals who have helped him bring his ideas to life. Two of his noteworthy collaborators are Roger D St Amand and ChangSuk Han. Together, they have shared their insights, expertise, and knowledge, resulting in breakthroughs in stackable package design and manufacturing processes. Collaborative efforts like these showcase the power of teamwork in driving innovation.

Conclusion:

Vladimir Perelman's contributions to the realm of stackable packaging and encapsulation operations have been instrumental in streamlining manufacturing processes and reducing costs. His inventive approach to developing stackable packages sets the stage for more efficient and cost-effective solutions in the industry. As Perelman continues to innovate and collaborate with other experts in the field, the future of advanced packaging technologies appears promising, benefiting companies and consumers alike.