Amkor Technology, Inc.

National Semiconductor Corporation

Amkor Technology Singapore Holding Pte. Ltd.

Vladimir Perelman

Roger D St Amand

Robert Francis Darveaux

ChangSuk Han

YounSang Kim

KyungRok Park

Noah L Anglin

Nick Bacile

InTae Kim

A stackable package is placed within a mold during an encapsulation operation. A compliant surface, e.g., of a compliant film, of the mold is pressed down on upper interconnection balls of the stackable package to force upper portions of the upper interconnection balls into the mold. However, lower portions of the upper interconnection balls are exposed within a space between the compliant surface and a substrate of the stackable package. The space is filled with a dielectric material to form a package body. The package body is formed while at the same time exposing the upper portions of upper interconnection balls from the package body in a single encapsulation operation. By avoiding selective removal of the package body to expose the upper interconnection balls, the number of operations as well as cost to manufacture the stackable package is minimized.

Stackable package and method

In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including at least two electronic components which are provided in a stacked arrangement, and are each electrically connected to an underlying substrate through the use of conductive wires. In accordance with one embodiment of the present invention, the electronic components are separated from each other by an intervening spacer which is typically fabricated from aluminum, or from silicon coated with aluminum. In this particular embodiment, the uppermost electronic component of the stack is electrically connected to at least one of the conductive wires through the use of a conductive paste layer which is also used to secure the uppermost electronic component to the underlying spacer. In this regard, one end of one of the conductive wires may be embedded in the conductive paste layer adjacent one side of the uppermost electronic component, or between the bottom surface of such electronic component and the spacer.

Semiconductor package with fast power-up cycle and method of making same

A film-on-wire spacer covers an entire upper surface of a lower electronic component. Accordingly, an upper electronic component is supported above bond pads and lower bond wires of the lower electronic component. This decreases the stress on the upper electronic component, e.g., during wirebonding, and thus decreases the chance of cracking the upper electronic component. Further, the lower bond wires are enclosed in and protected by the film-on-wire spacer. Further, the film-on-wire spacer is thin resulting in a minimum height of the stacked electronic component package.

Stacked electronic component package having film-on-wire spacer

A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a second semiconductor die and at least one second support that are attached to the active surface of the first semiconductor die and to a coplanar surface of the first support(s). A third level includes a third semiconductor die attached to the active surface of the second semiconductor die and to a coplanar surface of the second support(s). The second and third semiconductor dies do not overlap bond pads of the first and second semiconductor dies, respectively. An adhesive film overlies the entire inactive surface of the second and third semiconductor dies, and attaches the second and third semiconductor dies to the immediately underlying active surface and support(s).

Stacked flip chip die assembly

Stacked die assembly having semiconductor die projecting beyond support

Stacked die assembly having semiconductor die overhanging support

A structure includes a substrate having a first surface, a first semiconductor die, a spacer and a second semiconductor die. The first semiconductor die has an active surface with opposite first and second parallel rows of bond pads, and an opposite inactive surface attached to the first surface of the substrate. The spacer is coupled to the active surface of the first semiconductor die entirely within the first and second rows of bond pads of the first semiconductor die, the spacer overhanging at least one side of the first semiconductor die. The second semiconductor die has an active surface and an opposite inactive surface, the active surface of the second semiconductor die larger in area than the active surface of the first semiconductor die, the active surface of the second semiconductor die with at least one row of bond pads.

Stacked-die extension support structure and method thereof

Stacked semiconductor die assembly having at least one support

Lead frames for integrated circuit packaging are partly fabricated using laser machining to form the very small diameter (0.005 to 0.010 diameter) holes in the lead frames which are later used for epoxy adhesive penetration. A high power Nd:YAG laser provides a laser beam which is moved and focused by a control unit onto the surface of a continuous stock strip in order is to drill the epoxy holes at the desired locations. A similar apparatus, but using a copper vapor laser, can trim very fine pitch (0.005 inch) leads for the lead frames. The remaining parts of the lead frames, which involve larger sized elements, are formed conventionally by using stamping or etching. By controlling the laser operating parameters in terms of laser power, pulse duration and pulse frequency and by control of the location of the laser beam by deflecting galvanometers, very precise cutting and drilling can be accomplished, with accuracy down to 0.00005 inch or less. Tooling costs are thereby reduced and in addition new types of lead frames with very closely spaced lead tips can be fabricated that cannot be fabricated using conventional processes.

Growing community of inventors

Fremont, CA, United States of America

Vladimir Perelman