The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2006

Filed:

Nov. 17, 2004
Applicants:

Roger D. St. Amand, Tempe, AZ (US);

Intae Kim, Gwangju, KR;

Vladimir Perelman, Fremont, CA (US);

Inventors:

Roger D. St. Amand, Tempe, AZ (US);

InTae Kim, Gwangju, KR;

Vladimir Perelman, Fremont, CA (US);

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure includes a substrate having a first surface, a first semiconductor die, a spacer and a second semiconductor die. The first semiconductor die has an active surface with opposite first and second parallel rows of bond pads, and an opposite inactive surface attached to the first surface of the substrate. The spacer is coupled to the active surface of the first semiconductor die entirely within the first and second rows of bond pads of the first semiconductor die, the spacer overhanging at least one side of the first semiconductor die. The second semiconductor die has an active surface and an opposite inactive surface, the active surface of the second semiconductor die larger in area than the active surface of the first semiconductor die, the active surface of the second semiconductor die with at least one row of bond pads.


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