Company Filing History:
Years Active: 2013-2016
Title: **Vivian Ryan: Innovator in Interconnect Technologies**
Introduction
Vivian Ryan, an esteemed inventor based in Berne, NY, has made significant contributions to the field of interconnect technologies with a remarkable portfolio of 17 patents. Her innovative work focuses on developing advanced materials and methods to enhance the performance and reliability of microelectronic devices.
Latest Patents
Among her latest patents, the **combinatorial screening of metallic diffusion barriers** stands out. In this invention, barrier layers, barrier stacks, and seed layers for small-scale interconnects, such as copper, are combinatorially screened using test structures. These structures are sputtered or co-sputtered through apertures of varying sizes. The patent highlights the measurement of various characteristics, including resistivity and crystalline morphology, which are crucial for assessing conductivity, diffusion blocking, and adhesion. Results suggest that certain formulations of tantalum-titanium barriers could effectively replace thicker tantalum/tantalum-nitride stacks, offering improved performance in some configurations.
Another significant patent from Ryan is the **multi-layer barrier layer for interconnect structures**. This invention describes a method for forming an interconnect structure that includes creating a recess in a dielectric layer of a substrate and lining it with an adhesion barrier layer. The invention further introduces a stress-reducing barrier layer, which lowers stress levels across interfaces, ultimately enhancing the durability and effectiveness of the interconnects.
Career Highlights
Throughout her career, Vivian Ryan has worked with notable companies such as Globalfoundries Inc. and Intermolecular, Inc. Her expertise in material science and engineering has facilitated her progression into key roles where she has driven research and development initiatives focused on interconnect technologies.
Collaborations
Ryan has collaborated with other distinguished professionals in her field, including Xunyuan Zhang and Paul Raymond Besser. These partnerships have fostered innovative solutions in the realm of microelectronics, underscoring the collaborative spirit that propels advancements in technology.
Conclusion
Vivian Ryan continues to be a leading figure in the innovation of interconnect materials and methods. Her inventive approach and dedication to research have not only resulted in 17 patents but also enhanced the landscape of microelectronic devices, making her a pivotal player in the field. As she forges ahead, her work promises to inspire future innovations in technology.