Portland, OR, United States of America

Vivek Kumar Rajan

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2025-2026.

USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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2 patents (USPTO):Explore Patents

Title: Innovations of Vivek Kumar Rajan

Introduction

Vivek Kumar Rajan is an accomplished inventor based in Portland, OR (US). He is known for his contributions to the field of microelectronics, particularly in power delivery systems. His innovative work has led to the development of a unique patent that enhances the efficiency of microelectronic assemblies.

Latest Patents

Vivek Kumar Rajan holds a patent titled "Power delivery through capacitor-dies in a multi-layered microelectronic assembly." This patent describes a microelectronic assembly that includes an integrated circuit (IC) die in a first layer and multiple IC dies in a second layer. The design allows for at least two adjacent IC dies to be electrically coupled along their proximate edges. The assembly features interconnects with a pitch of less than 10 micrometers between adjacent interconnects, and the IC die incorporates capacitors and voltage regulator circuitry. He has 1 patent to his name.

Career Highlights

Vivek Kumar Rajan is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronic technology. His work at Intel has positioned him as a key player in the development of advanced electronic systems.

Collaborations

Throughout his career, Vivek has collaborated with notable colleagues, including Adel A Elsherbini and William J Lambert. These collaborations have further enriched his work and contributed to the advancement of innovative technologies in the field.

Conclusion

Vivek Kumar Rajan's contributions to microelectronics through his patent and work at Intel Corporation highlight his role as a significant inventor in the industry. His innovative approach to power delivery systems continues to influence the development of advanced microelectronic assemblies.

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