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Chandler, AZ, United States of America

Vinodhkumar Raghunathan

This inventor holds 6 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2014-2017.

USPTO Granted Patents = 6

% Patents Active = 50.0

Average Co-Inventor Count = 2.2

ph-index = 3

Forward Citations = 28(Granted Patents)

Company Filing History:

6 out of 56,222

Intel Corporation

Years Active: 2014-2017

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9748177 - Embedded structures for package-on-package architecture (2017-08-29),

2. 9633837 - Methods of providing dielectric to conductor adhesion in package structures (2017-04-25),

3. 9451696 - Embedded architecture using resin coated copper (2016-09-20),

4. 9368401 - Embedded structures for package-on-package architecture (2016-06-14),

5. 9136221 - Methods of providing dielectric to conductor adhesion in package structures (2015-09-15),

6. 8866287 - Embedded structures for package-on-package architecture (2014-10-21),

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