The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Sep. 29, 2012
Dilan Seneviratne, Chandler, AZ (US);
Ching-ping J. Shen, Gilbert, AZ (US);
Liwen Jin, Chandler, AZ (US);
Deepak Arora, Chandler, AZ (US);
Vinodhkumar Raghunathan, Chandler, AZ (US);
Dilan Seneviratne, Chandler, AZ (US);
Ching-Ping J. Shen, Gilbert, AZ (US);
Liwen Jin, Chandler, AZ (US);
Deepak Arora, Chandler, AZ (US);
Vinodhkumar Raghunathan, Chandler, AZ (US);
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.