IDiyas

For the Inventor, By the Inventor

Palo Alto, CA, United States of America

Vinh H Diep

USPTO Granted Patents = 17 


Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 50(Granted Patents)


Location History:

  • Milpitas, CA (US) (2009 - 2017)
  • Palo Alto, CA (US) (2014 - 2022)

Company Filing History:

goldMedal17 out of 40,816 
 
Apple Inc.
 patents

Years Active: 2009-2022

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17 patents (USPTO):
1. 11297732 - Thermal flow assembly including integrated fan (2022-04-05),
2. 10963024 - Combination parallel path heatsink and EMI shield (2021-03-30),
3. 10653034 - Thermal flow assembly including integrated fan (2020-05-12),
4. 10591956 - Foldable case for use with an electronic device (2020-03-17),
5. 10285303 - Electronic device with integrated passive and active cooling (2019-05-07),
6. 10061363 - Combination parallel path heatsink and EMI shield (2018-08-28),
7. 10034411 - Thermal flow assembly including integrated fan (2018-07-24),
8. 9760118 - Foldable case for use with an electronic device (2017-09-12),
9. 9612632 - Wireless electronic device with component cooling structures (2017-04-04),
10. 9408334 - Electronic device with component shielding structures and input-output connectors (2016-08-02),
11. 9095076 - Electronic device enclosures and heatsink structures with thermal management features (2015-07-28),
12. 9048124 - Heat sinking and electromagnetic shielding structures (2015-06-02),
13. 8760868 - Electronic device enclosures and heatsink structures with thermal management features (2014-06-24),
14. 8672126 - Foldable case for use with an electronic device (2014-03-18),
15. 8493740 - Component retention mechanism (2013-07-23),
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