The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Sep. 20, 2012
Applicants:

Dominic E. Dolci, Berkeley, CA (US);

James G. Smeenge, Los Gatos, CA (US);

Vinh H. Diep, Palo Alto, CA (US);

Chiew-siang Goh, San Jose, CA (US);

Inventors:

Dominic E. Dolci, Berkeley, CA (US);

James G. Smeenge, Los Gatos, CA (US);

Vinh H. Diep, Palo Alto, CA (US);

Chiew-Siang Goh, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/10 (2006.01); H01L 23/552 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 23/552 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/167 (2013.01); H01L 23/373 (2013.01); H01L 23/3736 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01);
Abstract

An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.


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