The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Jul. 19, 2018
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Eric R. Prather, Santa Clara, CA (US);

Clark E. Waterfall, Campbell, CA (US);

Reuben J. Williams, San Francisco, CA (US);

Vinh H. Diep, Palo Alto, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01); F28F 1/12 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20154 (2013.01); F28D 15/0233 (2013.01); H01L 23/427 (2013.01); F28F 1/12 (2013.01); F28F 2250/08 (2013.01); H01L 23/467 (2013.01);
Abstract

An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.


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