The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Sep. 04, 2015
Apple Inc., Cupertino, CA (US);
Jonathan A. Matheson, San Jose, CA (US);
Vinh H. Diep, Palo Alto, CA (US);
Brian L. Chuang, Menlo Park, CA (US);
Judith C. Segura, San Francisco, CA (US);
Frank F. Liang, San Jose, CA (US);
Leanne Bach Lien T. Ly, San Jose, CA (US);
Kevin Z. Lo, Belmont, CA (US);
Po W. Chiu, Campbell, CA (US);
Lukose Ninan, Foster City, CA (US);
Chong Li, Fremont, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.