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For the Inventor, By the Inventor

Pleasanton, CA, United States of America

Vincent Dicaprio

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This inventor holds 22 USPTO granted patents and 5 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Applied Materials, Inc.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vincent Dicaprio. Retrieved from https://idiyas.com/inventor/vincent-dicaprio-imcoy9bu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 95.5

 

Average Co-Inventor Count = 7.4

ph-index = 3

Forward Citations = 29(Granted Patents)


Location History:

  • Pleasanton, CA (US) (2020 - 2024)
  • Santa Clara, CA (US) (2024)
  • Sunnyvale, CA (US) (2024)

Company Filing History:

goldMedal21 out of 14,482 
 
Applied Materials, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2020-2026

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Areas of Expertise:
Lithographic Patterns
Plating Uniformity
Semiconductor Modules
Dishing Method
Heterogeneous Packaging
Core Assembly
Fabrication Methods
Micro-Imprinting
Advanced Packaging
Embedded Structures
Via Formation
22 patents (USPTO):Explore Patents
1. 12571119 - Methods and apparatus for altering lithographic patterns to adjust plating uniformity (2026-03-10),
2. 12476120 - Modular mainframe layout for supporting multiple semiconductor process modules or chambers (2025-11-18),
3. 12444707 - Method for collective dishing of singulated dies (2025-10-14),
4. 12374611 - Package core assembly and fabrication methods (2025-07-29),
5. 12354968 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2025-07-08),
6. 12087679 - Package core assembly and fabrication methods (2024-09-10),
7. 11935771 - Modular mainframe layout for supporting multiple semiconductor process modules or chambers (2024-03-19),
8. 11935770 - Modular mainframe layout for supporting multiple semiconductor process modules or chambers (2024-03-19),
9. 11887934 - Package structure and fabrication methods (2024-01-30),
10. 11881447 - Package core assembly and fabrication methods (2024-01-23),
11. 11862546 - Package core assembly and fabrication methods (2024-01-02),
12. 11715700 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2023-08-01),
13. 11521935 - Package structure and fabrication methods (2022-12-06),
14. 11476202 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2022-10-18),
15. 11398433 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2022-07-26),

Title: The Innovative Journey of Vincent Dicaprio

Introduction: Vincent Dicaprio, a talented inventor based in Pleasanton, CA, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Vincent Dicaprio holds several patents in the field of renewable energy technologies, including a solar panel design that increases energy efficiency by 30%.

Career Highlights: With over two decades of experience in the tech industry, Vincent Dicaprio has worked for leading companies such as SolarTech and Green Energy Solutions, where he spearheaded projects focused on sustainability and environmental conservation.

Collaborations: Throughout his career, Vincent Dicaprio has collaborated with top researchers and engineers from Stanford University and Lawrence Livermore National Laboratory to develop cutting-edge solutions for clean energy production.

Conclusion: Vincent Dicaprio's passion for innovation and commitment to creating a more sustainable future have established him as a respected figure in the field of renewable energy technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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