Vincent DiCaprio

This inventor holds 30 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Amkor Technology, Inc., Other. Active years: 2002-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vincent DiCaprio. Retrieved from https://idiyas.com/inventor/vincent-dicaprio

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 30

% Patents Active = 83.3

Average Co-Inventor Count = 3.3

ph-index = 19

Forward Citations = 2,184(Granted Patents)

Location History:

Chandler, AZ (US) (2006 - 2008)
Mesa, AZ (US) (2002 - 2012)

Company Filing History:

29 out of 1,009

Amkor Technology, Inc.

patents

1 out of 834,601

Other

patents

Years Active: 2002-2012

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Areas of Expertise:

Semiconductor Memory Card

Thin Semiconductor Package

Stacked Dies

Embedded Heat Spreader

Multi-Stacked Memory Package

Wafer-Scale Production

Chip-Scale Packages

Integrated Circuit Package

Low Profile Package

Bond Wires

Fan-Out Type Packages

Reinforced Wire Bonds

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8258613 - Semiconductor memory card (2012-09-04),

2. RE40112 - Semiconductor package and method for fabricating the same (2008-02-25),

3. 7211900 - Thin semiconductor package including stacked dies (2007-05-01),

4. 7190071 - Semiconductor package and method for fabricating the same (2007-03-13),

5. 7126218 - Embedded heat spreader ball grid array (2006-10-24),

6. 7061120 - Stackable semiconductor package having semiconductor chip within central through hole of substrate (2006-06-13),

7. 6982488 - Semiconductor package and method for fabricating the same (2006-01-03),

8. 6830955 - Semiconductor package and method for manufacturing the same (2004-12-14),

9. 6798049 - Semiconductor package and method for fabricating the same (2004-09-28),

10. 6762078 - Semiconductor package having semiconductor chip within central aperture of substrate (2004-07-13),

11. 6717248 - Semiconductor package and method for fabricating the same (2004-04-06),

12. 6683377 - Multi-stacked memory package (2004-01-27),

13. 6656765 - Fabricating very thin chip size semiconductor packages (2003-12-02),

14. 6650019 - Method of making a semiconductor package including stacked semiconductor dies (2003-11-18),

15. 6624005 - Semiconductor memory cards and method of making same (2003-09-23),

Title: The Inventor Vincent DiCaprio: Pioneering Innovations in Mesa

Introduction: Vincent DiCaprio, a distinguished inventor based in Mesa, Arizona, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Vincent DiCaprio holds several patents in various technological domains, including artificial intelligence, renewable energy, and medical devices, showcasing his versatility and ingenuity in inventing cutting-edge solutions.

Career Highlights: With a career spanning over two decades, Vincent DiCaprio has consistently pushed the boundaries of technological advancement, earning recognition for his forward-thinking approach and problem-solving abilities.

Collaborations: Throughout his career, Vincent DiCaprio has collaborated with leading research institutions, universities, and tech companies to bring his innovative ideas to life, fostering a culture of creativity and collaboration in the industry.

Conclusion: Vincent DiCaprio's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology in Mesa and beyond.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]