The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Aug. 07, 2001
Robert F. Darveaux, Higley, AZ (US);
Frederick J. G. Hamilton, Chandler, AZ (US);
Bruce M. Guenin, Glibert, AZ (US);
Vincent Dicaprio, Mesa, AZ (US);
Robert F. Darveaux, Higley, AZ (US);
Frederick J. G. Hamilton, Chandler, AZ (US);
Bruce M. Guenin, Glibert, AZ (US);
Vincent DiCaprio, Mesa, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying substrate, and electrical interconnections between the die and the substrate, such as bond wires. The outer portion of the heat spreader substantially cover the outer portion of the substrate, or alternatively, cover only those portions extending in laterally from the sides of the chip and not the corners. An encapsulant completely covers the heat spreader and die.