Veronika Huber

Title: Veronika Huber: Innovator in Semiconductor Technology

Introduction

Veronika Huber is a prominent inventor based in Bad Abbach, Germany. She has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase her innovative spirit and technical expertise.

Latest Patents

One of her latest patents is titled "Semiconductor device including an antenna." This invention involves a semiconductor device that comprises a semiconductor chip and a redistribution layer on one side of the chip. The redistribution layer is electrically coupled to the semiconductor chip, and the device includes a dielectric layer with an antenna positioned on it. The dielectric layer serves as a barrier between the antenna and the semiconductor chip.

Another notable patent is "Molded semiconductor package with backside die metallization." This patent describes a manufacturing process for a semiconductor package that involves providing a semiconductor die with a terminal on one side. The die is embedded in a molding compound, which covers all sides except the terminal side. The molding compound is thinned adjacent to the opposing side of the die, allowing for an electrical connection to be formed without exposing the die itself.

Career Highlights

Veronika Huber is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. Her work at Infineon has allowed her to push the boundaries of technology and contribute to advancements in the industry.

Collaborations

Throughout her career, Veronika has collaborated with talented individuals such as Thomas Kilger and Dominic Maier. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Veronika Huber is a remarkable inventor whose work in semiconductor technology has made a lasting impact. Her patents reflect her dedication to innovation and her ability to solve complex engineering challenges.