Infineon Technologies Ag

Veronika Huber

Dominic Maier

Thomas Kilger

Ralf Otremba

Saverio Trotta

Klaus Schiess

Georg Meyer-Berg

Ashutosh Baheti

Uwe Wahl

Maciej Wojnowski

Bernd Stadler

Ulrich Wachter

Claus Waechter

Ngoc-Hoa Huynh

Franz-Xaver Muehlbauer

Andreas Schlögl

A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.

Semiconductor device including an antenna

A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame.

Molded semiconductor package with backside die metallization

Growing community of inventors

Bad Abbach, Germany

Veronika Huber