Veronica Sciriha

Title: Innovations of Veronica Sciriha

Introduction

Veronica Sciriha is a prominent inventor based in Munich, Germany. She has made significant contributions to the field of microelectronics, holding a total of 5 patents. Her work focuses on integrating and accessing passive components in wafer-level packages, showcasing her expertise in advanced packaging technologies.

Latest Patents

One of her latest patents involves a method of integrating and accessing passive components in three-dimensional fan-out wafer-level packages. This innovation includes a microelectronic die package that features a die, a package substrate attached to the die on one side, and a configuration that allows connection to a system board. Additionally, it incorporates a plurality of passive devices on the second side of the die, along with passive device contacts designed to couple with a second die mounted over these passive devices.

Career Highlights

Throughout her career, Veronica has worked with leading technology companies, including Intel Corporation and Intel IP Corporation. Her experience in these organizations has allowed her to develop cutting-edge technologies that enhance the performance and efficiency of electronic devices.

Collaborations

Veronica has collaborated with notable professionals in her field, including Gianni Signorini and Thomas Wagner. These partnerships have contributed to her innovative projects and advancements in microelectronics.

Conclusion

Veronica Sciriha's contributions to the field of microelectronics through her patents and collaborations highlight her role as a leading inventor. Her work continues to influence the development of advanced packaging technologies in the industry.