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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10867934 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Mar. 27, 2018

Component magnetic shielding for microelectronic devices

Applicant:

Intel Ip Corporation, Santa Clara, CA (US);

Inventors:

Saravana Maruthamuthu, Munich, DE;

Thomas Ort, Veitsbronn, DE;

Andreas Wolter, Regensburg, DE;

Andreas Augustin, Munich, DE;

Veronica Sciriha, Munich, DE;

Bernd Waidhas, Pettendorf, DE;

Assignee:

Intel IP Corporation, Santa Clara, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

David Vu

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/64 (2006.01); H01F 41/00 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/645 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01F 27/2804 (2013.01); H01F 41/00 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16265 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A microelectronic device may include a substrate, a component, a first plate, a second plate, and a shield. The component may be disposed at least partially within the substrate. The first plate may be disposed on a first side of the component. The second plate may be disposed on a second side of the component. The shield may be disposed around at least a portion of a periphery of the component.

Find Patent Forward Citations

Maruthamuthu, Saravana. (2020). Component magnetic shielding for microelectronic devices (U.S. Patent No. 10867934). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10867934

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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