Vani Verma

USPTO Granted Patents = 13 (Patent Applications = 1)

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 120(Granted Patents)

Company Filing History:

7 out of 3,549

Cypress Semiconductor Corporation

patents

3 out of 4,549

Sandisk Technologies Inc.

patents

2 out of 145

Matrix Semiconductor, Inc.

Years Active: 2001-2013

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8395246 - Two-sided die in a four-sided leadframe based package (2013-03-12),

2. 8349655 - Method of fabricating a two-sided die in a four-sided leadframe based package (2013-01-08),

3. 8058099 - Method of fabricating a two-sided die in a four-sided leadframe based package (2011-11-15),

4. 7432599 - Memory module having interconnected and stacked integrated circuits (2008-10-07),

5. 7391104 - Non-stick detection method and mechanism for array molded laminate packages (2008-06-24),

6. 7105377 - Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process (2006-09-12),

7. 7005730 - Memory module having interconnected and stacked integrated circuits (2006-02-28),

8. 6853202 - Non-stick detection method and mechanism for array molded laminate packages (2005-02-08),

9. 6731011 - Memory module having interconnected and stacked integrated circuits (2004-05-04),

10. 6730532 - Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process (2004-05-04),

11. 6576491 - Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame (2003-06-10),

12. 6562272 - Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages (2003-05-13),

13. 6331728 - High reliability lead frame and packaging technology containing the same (2001-12-18),

Title: Vani Verma: Innovator in Semiconductor Packaging

Introduction

Vani Verma is a prominent inventor based in Sunnyvale, CA (US). She has made significant contributions to the field of semiconductor packaging, holding a total of 13 patents. Her innovative work has paved the way for advancements in the design and fabrication of semiconductor packages.

Latest Patents

Among her latest patents are methods for fabricating a two-sided die in a four-sided leadframe-based package. These patents disclose a semiconductor die that has die bond pads along two adjacent edges, which can be electrically coupled to four sides of a four-sided leadframe. The embodiments of her inventions relate to both lead and no-lead type leadframes, showcasing her expertise in semiconductor technology.

Career Highlights

Vani has worked with notable companies such as Cypress Semiconductor Corporation and SanDisk Technologies Inc. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking projects in the semiconductor industry.

Collaborations

Some of her notable coworkers include Bo Soon Chang and Khushrav S Chhor. Their collaboration has likely fostered an environment of innovation and creativity in their respective projects.

Conclusion

Vani Verma's contributions to semiconductor packaging through her patents and collaborations highlight her role as a key innovator in the field. Her work continues to influence the industry and inspire future advancements.

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1 patent pending:

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