Valery Ouvarov-Bancalero

Title: Valery Ouvarov-Bancalero: Innovator in Integrated Circuit Packaging

Introduction

Valery Ouvarov-Bancalero is a notable inventor based in Scottsdale, AZ (US). He has made significant contributions to the field of integrated circuit packaging, holding 3 patents that showcase his innovative approach to technology.

Latest Patents

One of his latest patents is titled "Package substrate z-disaggregation with liquid metal interconnects." This invention involves a z-disaggregated integrated circuit package substrate assembly that includes a coreless patch, a core patch, and an interposer. The coreless patch features thinner dielectric layers and higher density routing, allowing for enhanced communication between integrated circuit dies. The core layer serves as an interconnect between the coreless patch and the interposer, utilizing liquid metal interconnects for physical and electrical connections. This design aims to reduce costs while improving overall yield and electrical performance compared to traditional monolithic substrates.

Another significant patent is "Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE." This invention focuses on a stiffener for an integrated circuit package assembly, which is mechanically attached to the substrate adjacent to the IC die. The stiffener is designed to have a coefficient of linear thermal expansion (CTE) that exceeds that of the substrate, utilizing materials such as anti-invar metallic alloys. This innovation enhances the thermal expansion properties of the package, contributing to improved performance in various applications.

Career Highlights

Valery Ouvarov-Bancalero is currently employed at Intel Corporation, where he continues to push the boundaries of technology in integrated circuit packaging. His work has been instrumental in developing solutions that address the challenges faced in the industry.

Collaborations

Throughout his career, Valery has collaborated with talented individuals such as Brandon C Marin and Tarek A Ibrahim. These partnerships have fostered an environment of innovation and creativity, leading to advancements in integrated circuit technology.

Conclusion

Valery Ouvarov-Bancalero is a prominent figure in the field of integrated circuit packaging, with a focus on innovative solutions that enhance performance and reduce costs. His contributions through patents and collaborations reflect his commitment to advancing technology in this critical area.