The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Mar. 04, 2021
Intel Corporation, Santa Clara, CA (US);
Valery Ouvarov-Bancalero, Scottsdale, AZ (US);
John Harper, Chandler, AZ (US);
Malavarayan Sankarasubramanian, Tempe, AZ (US);
Patrick Nardi, Scottsdale, AZ (US);
Bamidele Daniel Falola, Chandler, AZ (US);
Ravi Siddappa, Gilbert, AZ (US);
James Mertens, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an 'anti-invar' metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.