This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2024.
Company Filing History:
Years Active: 2024
Title: Innovations of Ravi Siddappa in Integrated Circuit Technology
Introduction
Ravi Siddappa is an accomplished inventor based in Gilbert, AZ (US). He has made significant contributions to the field of integrated circuit technology, particularly through his innovative patent work. His expertise and creativity have led to advancements that enhance the performance and reliability of electronic devices.
Latest Patents
Ravi Siddappa holds a patent for "Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE." This invention involves a stiffener for an integrated circuit (IC) package assembly that includes an IC die electrically interconnected to a substrate. The stiffener is designed to be mechanically attached to the substrate adjacent to at least one edge of the IC die and possesses a coefficient of linear thermal expansion (CTE) that exceeds that of the substrate. Notably, the stiffener may be made from an 'anti-invar' metallic alloy, which exhibits enhanced thermal expansion properties compared to other compositions within the alloy system. Examples of suitable materials for the package stiffener include high-Mn steel, such as ASTM International A128, and various alloys like MnCuNi, FeNiMn, or FeNiCr, which have an average CTE of at least 18 ppm over a temperature range of 25-100° C and a room temperature modulus of elasticity of at least 120 GPa.
Career Highlights
Ravi Siddappa is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his innovative work. His contributions have not only advanced the field of integrated circuits but have also positioned him as a key player in the industry.
Collaborations
Ravi has collaborated with notable colleagues, including Valery Ouvarov-Bancalero and Malavarayan Sankarasubramanian. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Ravi Siddappa's work in integrated circuit technology exemplifies the spirit of innovation and creativity. His patent on integrated circuit die package stiffeners showcases his ability to address complex challenges in the field. Through his contributions at Intel Corporation, he continues to make a lasting impact on the technology landscape.