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For the Inventor, By the Inventor

Dongshi, Taiwan

Uway Tseng

This inventor holds 7 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2008-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Uway Tseng. Retrieved from https://idiyas.com/inventor/uway-tseng-jw18yb02

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 71.4

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 42(Granted Patents)


Location History:

  • Dongshin Township, Taichung Country, TW (2008)
  • Dongshin Township, Taichung County, TW (2011)
  • Tai-Zhong County, TW (2013)
  • Dong-Shi Town, TW (2013 - 2014)
  • Dong-Shi, TW (2014)
  • Tai-zhong, TW (2014)

Company Filing History:

goldMedal7 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2008-2014

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7 patents (USPTO):Explore Patents
1. 8716871 - Big via structure (2014-05-06),
2. 8680635 - CMOS image sensor big via bonding pad application for AICu process (2014-03-25),
3. 8633086 - Power devices having reduced on-resistance and methods of their manufacture (2014-01-21),
4. 8502335 - CMOS image sensor big via bonding pad application for AlCu Process (2013-08-06),
5. 8344471 - CMOS image sensor big via bonding pad application for AICu process (2013-01-01),
6. 7884013 - Dual damascene with via liner (2011-02-08),
7. 7387961 - Dual damascene with via liner (2008-06-17),

Title: Uway Tseng: Innovator in Semiconductor Technology

Introduction

Uway Tseng is a prominent inventor based in Dongshi, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on innovative designs that enhance the performance and efficiency of semiconductor devices.

Latest Patents

One of Uway Tseng's latest patents is for a big via structure in a semiconductor device. This invention includes a first metal layer component formed over a substrate, with a via that has a recessed shape. The design incorporates a second metal layer component and a first dielectric layer component that contains fluorine. Additionally, a second dielectric layer component is formed over the first, ensuring that it is free of fluorine.

Another notable patent is related to a CMOS image sensor big via bonding pad application for the AICu process. This integrated circuit features a substrate with a bonding pad region and a non-bonding pad region. A relatively large via, referred to as a 'big via,' is formed in the bonding region, which has a first dimension in a top view. The circuit also includes multiple smaller vias in the non-bonding region, each with a dimension significantly less than that of the big via.

Career Highlights

Uway Tseng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of integrated circuits and semiconductor devices.

Collaborations

Throughout his career, Uway has collaborated with talented individuals such as Yu-Ting Lin and Lin-June Wu. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Uway Tseng's contributions to semiconductor technology through his innovative patents highlight his expertise and commitment to advancing the field. His work continues to influence the design and functionality of modern semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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