The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2011

Filed:

May. 27, 2008
Applicants:

Uway Tseng, Dongshin Township, Taichung County, TW;

Alex Huang, Dongshan Township, Yilan County, TW;

Kun-szu Liu, Sanchong, TW;

Inventors:

Uway Tseng, Dongshin Township, Taichung County, TW;

Alex Huang, Dongshan Township, Yilan County, TW;

Kun-Szu Liu, Sanchong, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A dual damascene structure with improved profiles and reduced defects and method of forming the same, the method including forming a first dielectric over a conductive area; forming a first dielectric insulator over the first dielectric; forming a first opening in the first dielectric insulator; lining the opening with a second dielectric; forming a second dielectric insulator over the first dielectric insulator; forming a second opening in the second dielectric insulator overlying and communicating with the first opening; and, filling the first and second openings with a conductive material to electrically communicate with the conductive area.


Find Patent Forward Citations

Tseng, Uway. (2011). Dual damascene with via liner (U.S. Patent No. 7884013). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7884013

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…