Miaoli, Taiwan

Tzung-Chi Fu

USPTO Granted Patents = 67 

Average Co-Inventor Count = 5.8

ph-index = 6

Forward Citations = 206(Granted Patents)

Forward Citations (Not Self Cited) = 174(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Maioli, TW (2010 - 2012)
  • Miaoli, Miaoli County, TW (2020)
  • Hsinchu, TW (2023)
  • Miaoli, TW (2002 - 2024)
  • Miaoli County, TW (2018 - 2024)

Company Filing History:


Years Active: 2002-2025

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67 patents (USPTO):

Title: The Innovative Contributions of Tzung-Chi Fu in Semiconductor Technology

Introduction: Tzung-Chi Fu is a prominent inventor based in Miaoli, Taiwan, renowned for his significant contributions to semiconductor technology. With an impressive portfolio of 64 patents, he has consistently pushed the boundaries of innovation in the field, particularly in methods and apparatus for lithography and reticle management.

Latest Patents: Among his most recent inventions are two groundbreaking patents. The first, titled "Reticle Carrier and Associated Methods," introduces a novel reticle carrier designed to efficiently discharge residual charges on reticles. This innovation helps minimize the attraction of particles to the reticle, ultimately enhancing the quality of semiconductor device manufacturing. The reduction in capacitance between the carrier and the reticle expedites the discharge process, resulting in fewer pattern defects transferred during production.

The second patent, "EUV Light Source and Apparatus for Lithography," encompasses an extreme ultraviolet (EUV) radiation source apparatus. This apparatus incorporates advanced features such as a target droplet generator for producing tin droplets and a rotatable debris collection device. Notably, the device's vanes are coated with a catalytic layer, improving the efficiency of the process by converting SnH to Sn, thus enhancing the overall efficacy of lithography techniques.

Career Highlights: Tzung-Chi Fu's career is distinguished by his tenure at Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he has made significant strides in the industry. His ability to integrate theoretical knowledge with practical applications has led to innovations that play critical roles in semiconductor production.

Collaborations: Throughout his career, Tzung-Chi Fu has collaborated with esteemed colleagues such as Li-Jui Chen and Po-Chung Cheng. These partnerships have fostered a dynamic exchange of ideas and expertise, enabling the development of cutting-edge technologies that address the complex challenges faced in semiconductor manufacturing.

Conclusion: Tzung-Chi Fu stands as a testament to the power of innovation in the semiconductor industry. His extensive patent portfolio and groundbreaking inventions demonstrate a commitment to enhancing manufacturing processes and quality. As technology continues to evolve, Fu's contributions will undoubtedly leave a lasting impact on the field, paving the way for future advancements in semiconductor technology.

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