This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Industrial Technology Research Institute. Active years: 2010-2013.
Location History:
- Hsin Chu Hsien, TW (2010)
- Taipei, TW (2012 - 2013)
Company Filing History:
Years Active: 2010-2013
Title: Tzu-Ying Kuo: Innovator in Three-Dimensional Stacking Technology
Introduction
Tzu-Ying Kuo is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of three-dimensional stacking technology, holding a total of 3 patents. His innovative work focuses on enhancing the reliability and efficiency of electronic components.
Latest Patents
One of Tzu-Ying Kuo's latest patents is titled "Package structure of three-dimensional stacking dice and method for manufacturing the same." This invention provides a package structure that utilizes Through-Silicon-Vias (TSVs) technology to establish vertical electrical connections between stacking dice. The method enhances the reliability of the structure by employing a conductive bump that covers the pads, preventing breakage.
Another notable patent is "Three-dimensional conducting structure and method of fabricating the same." This invention features a substrate with a first and second redistributed conductor, along with an insulator. The design allows for efficient electrical connections while maintaining structural integrity.
Career Highlights
Tzu-Ying Kuo is affiliated with the Industrial Technology Research Institute, where he continues to push the boundaries of technology. His work has been instrumental in advancing the field of electronic packaging and three-dimensional structures.
Collaborations
Throughout his career, Tzu-Ying Kuo has collaborated with notable colleagues, including Shu-Ming Chang and Hsiang-Hung Chang. These partnerships have fostered innovation and contributed to the success of his projects.
Conclusion
Tzu-Ying Kuo's contributions to three-dimensional stacking technology exemplify his commitment to innovation in the electronics field. His patents reflect a deep understanding of complex engineering challenges and a dedication to improving electronic component reliability.