The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Jan. 28, 2008
Shu-ming Chang, Hsinchu, TW;
Tzu-ying Kuo, Hsin Chu Hsien, TW;
Chia-wen Chiang, Hsin Chu Hsien, TW;
Hsiang-hung Chang, Hsin Chu Hsien, TW;
Shu-Ming Chang, Hsinchu, TW;
Tzu-Ying Kuo, Hsin Chu Hsien, TW;
Chia-Wen Chiang, Hsin Chu Hsien, TW;
Hsiang-Hung Chang, Hsin Chu Hsien, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
This invention provides an image sensor module with a three-dimensional die-stacking structure. By filling a conductive material into through silicon vias within at least one image sensor die, and into via holes within an insulating layer, vertical electrical connections are formed between the image sensor die and an image processor buried in the insulating layer. A plurality of solder bumps is formed on a backside of the image sensor module so that the module can be directly assembled onto a circuit board. The image sensor module of this invention is characterized by a wafer-level packaging architecture and a three-dimensional die-stacking structure, which reduces electrical connection lengths within the module and thus reduces an area and height of the whole packaged module.