The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Sep. 05, 2008
Chun-te Lin, Taipei County, TW;
Tzu-ying Kuo, Taipei, TW;
Shu-ming Chang, Taipei County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
This invention provides a package structure of three-dimensional stacking dice and its manufacturing method. This invention employs the Through-Silicon-Vias (TSVs) technology to establish vertical electrical connection of the three-dimensional stacking dice and a redistribution layer between a blind hole-on-pad and a vertical through hole formed by the TSVs technology to direct the electrical connection from a first surface to an opposite second surface of this structure. In addition, this invention employs a conductive bump completely covering the pads jointed together between the stacking dice to avoid breakage of the pads. The reliability of the three-dimensional stacking dice of the present invention is increased.