Taipei, Taiwan

Tzong-Ming Wu

This inventor holds 26 USPTO granted patents, primarily in Metal Additive Manufacturing. Top assignees: Industrial Technology Research Institute, National Taiwan University. Active years: 1999-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzong-Ming Wu. Retrieved from https://idiyas.com/inventor/tzong-ming-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 73.1

Average Co-Inventor Count = 2.7

ph-index = 10

Forward Citations = 242(Granted Patents)


Location History:

  • Hsinchu Hsien, TW (2006)
  • Hsinchu, TW (1999 - 2011)
  • Taipei, TW (2000 - 2023)

Company Filing History:


Years Active: 1999-2023

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Areas of Expertise:
Metal Additive Manufacturing
3D Image Correction
Orthotics Design
Wafer Loading System
Prosthetic Devices
Clean Container
Wafer Retainer
Mechanically Actuated Devices
Positioning Mechanism
Fastening Structure
Personal Guided Transport
Standard Mechanical Interface
26 patents (USPTO):Explore Patents

Title: Inventor Tzong-Ming Wu

Introduction: Tzong-Ming Wu is a renowned inventor hailing from Taipei, Taiwan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Tzong-Ming Wu holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his innovative spirit and expertise in these domains.

Career Highlights: Throughout his career, Tzong-Ming Wu has worked with leading research institutions and technology companies, where he has spearheaded projects that have led to significant advancements in the industry.

Collaborations: Tzong-Ming Wu has collaborated with top engineers, scientists, and inventors from around the world, fostering a culture of innovation and knowledge exchange that has resulted in cutting-edge inventions.

Conclusion: Tzong-Ming Wu's dedication to pushing the boundaries of technology and his passion for innovation continue to inspire the next generation of inventors and researchers worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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