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For the Inventor, By the Inventor

Zhubei, Taiwan

Tung-Hsien Hsieh

This inventor holds 15 USPTO granted patents and 1 EPO patent. Top assignee: Mediatek Corporation. Active years: 2010-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tung-Hsien Hsieh. Retrieved from https://idiyas.com/inventor/tung-hsien-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15

% Patents Active = 100.0


Average Co-Inventor Count = 1.7

ph-index = 3

Forward Citations = 57(Granted Patents)


Location History:

  • Changhua County, TW (2010 - 2012)
  • Zhubei, TW (2016 - 2018)
  • Hsinchu County, TW (2017 - 2019)

Company Filing History:

goldMedal15 out of 5,115 
 
Mediatek Corporation
 patents

Years Active: 2010-2024

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15 patents (USPTO):Explore Patents
1. 12158482 - Probe card assembly (2024-12-03),
2. 10224287 - Semiconductor device and wafer level package including such semiconductor device (2019-03-05),
3. 10147674 - Semiconductor package assembly (2018-12-04),
4. 10079192 - Semiconductor chip package assembly with improved heat dissipation performance (2018-09-18),
5. 9704808 - Semiconductor device and wafer level package including such semiconductor device (2017-07-11),
6. 9704792 - Semiconductor package assembly (2017-07-11),
7. 9704785 - Semiconductor package with die paddle (2017-07-11),
8. 9331054 - Semiconductor package assembly with decoupling capacitor (2016-05-03),
9. 8288870 - Semiconductor chip package and method for designing the same (2012-10-16),
10. 8084853 - Semiconductor flip chip package utilizing wire bonding for net switching (2011-12-27),
11. 8044496 - QFN semiconductor package (2011-10-25),
12. 8039933 - QFN semiconductor package (2011-10-18),
13. 8039319 - Method for fabricating QFN semiconductor package (2011-10-18),
14. 7884481 - Semiconductor chip package and method for designing the same (2011-02-08),
15. 7786557 - QFN Semiconductor package (2010-08-31),

Title: Innovations of Tung-Hsien Hsieh

Introduction

Tung-Hsien Hsieh is a prominent inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 15 patents. His work primarily focuses on advancements in probe card assemblies and semiconductor devices.

Latest Patents

One of his latest patents is a probe card assembly that includes a circuit board, a substrate, and at least one passive component. The substrate is disposed opposite and connected to the circuit board. The circuit board features a first opening facing the substrate, while the substrate has a second opening facing the circuit board. The passive component is positioned between the circuit board and the substrate, partially accommodated in at least one of the openings. Another notable patent involves a semiconductor device and wafer-level package that includes an RDL structure on a passivation layer. This structure features landing pads and vias that electrically connect to on-chip metal pads, along with traces that enhance the device's functionality.

Career Highlights

Tung-Hsien Hsieh is currently employed at MediaTek Corporation, a leading company in semiconductor technology. His innovative work has played a crucial role in advancing the capabilities of semiconductor devices, making them more efficient and effective.

Collaborations

He has collaborated with notable coworkers such as Nan-Cheng Chen and Che-Ya Chou, contributing to various projects that push the boundaries of technology.

Conclusion

Tung-Hsien Hsieh's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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