The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Nov. 19, 2009
Applicant:
Tung-hsien Hsieh, Changhua County, TW;
Inventor:
Tung-Hsien Hsieh, Changhua County, TW;
Assignee:
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
Abstract
This invention provides a semiconductor flip chip package including a carrier substrate and a flip chip mounted on the carrier substrate. The flip chip comprises a first input/output (I/O) pad and a second I/O pad on an active surface of the flip chip, wherein a switching between the first I/O pad and the second I/O pad is implemented by wire bonding.