The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Jan. 25, 2016
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2006.01); H01L 23/29 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/3171 (2013.01); H01L 23/3192 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/53228 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/20 (2013.01); H01L 24/25 (2013.01); H01L 25/0655 (2013.01); H01L 23/291 (2013.01); H01L 23/525 (2013.01); H01L 24/24 (2013.01); H01L 24/96 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05013 (2013.01); H01L 2224/05015 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/244 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/73209 (2013.01); H01L 2924/14 (2013.01); H01L 2924/18162 (2013.01);
Abstract
An RDL structure on a passivation layer includes a first landing pad disposed directly above a first on-chip metal pad; a first via in a passivation layer to electrically connect the first landing pad with the first on-chip metal pad; a second landing pad disposed directly above the second on-chip metal pad; a second via in the passivation layer to electrically connect the second landing pad with the second on-chip metal pad; and at least five traces being disposed on the passivation layer and passing through a space between the first landing pad and the second landing pad.