The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
Jun. 05, 2017
Mediatek Inc., Hsin-Chu, TW;
Tung-Hsien Hsieh, Zhubei, TW;
Che-Ya Chou, Kaohsiung, TW;
MediaTek Inc., Hsin-Chu, TW;
Abstract
Various structures of a semiconductor package assembly are provided. In one implementation, a semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface and a bump-attach surface opposite the die-attach surface. A semiconductor die is mounted on the die-attach surface of the redistribution layer (RDL) structure. A first solder mask layer disposed on the die-attach surface, surrounding the semiconductor die. Further, a first conductive bump disposed over the first solder mask, coupled to a first pad of the redistribution layer (RDL) structure through a single circuit structure on a portion the first solder mask layer, wherein a first distance between a center of the first pad and a sidewall of the semiconductor die, which is close to the first pad, is equal to or greater than a second distance between a center of the first conductive bump and the sidewall of the semiconductor die.