Hsinchu, Taiwan

Tung-Han Chuang


Average Co-Inventor Count = 2.8

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2012-2025

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4 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Tung-Han Chuang in Nanotechnology**

Introduction

Tung-Han Chuang, a notable inventor based in Hsinchu, Taiwan, has made significant strides in the nanotechnology sector. With a total of four patents to his name, his research and innovations focus on developing advanced structures and methods that enhance the performance of metallic thin films and bonding technologies.

Latest Patents

Among his latest patents, Chuang introduced a groundbreaking invention titled "Nano-twinned Structure on Metallic Thin Film Surface and Method for Forming the Same." This patent describes a novel nano-twinned structure comprising a substrate, an adhesive-lattice-buffer layer, and a metallic thin film layer made of materials such as silver (Ag), copper (Cu), gold (Au), palladium (Pd), or nickel (Ni). The metallic thin film is characterized by equi-axial coarse grains and a surface region enriched with parallel-arranged high-density twin boundaries. These features are intricately designed to improve the properties of the metallic thin film, achieving significant enhancements in durability and performance through post-deposition ion bombardment.

Another pivotal invention by Chuang is focused on "Bonding Structures and Methods for Forming the Same." This patent presents an innovative bonding structure involving a first and a second substrate, along with bonding layers that incorporate a silver feature characterized by a nano-twinned structure. The creation of these bonding structures is achieved through advanced techniques such as sputtering or evaporation coating, supplemented with negative bias ion bombardment. This method allows for the formation of high-performance bonds critical for optimizing material applications.

Career Highlights

Over the years, Tung-Han Chuang has contributed his expertise to various esteemed companies, including Ag Materials Technology Co., Ltd. and Macronix International Co., Ltd. His work in these organizations has been pivotal in advancing the field of materials science and nanotechnology, showcasing his ability to apply theoretical concepts to practical solutions.

Collaborations

Throughout his career, Chuang has collaborated with distinguished colleagues like Hsing-Hua Tsai and Yung-Tai Hung. These partnerships have further strengthened his research efforts and have led to fruitful outcomes in their shared objectives of innovation and excellence in the field.

Conclusion

Tung-Han Chuang stands out as a prominent figure in the realm of nanotechnology, with his innovative patents reflecting a deep commitment to enhancing the capabilities of metallic materials. His contributions continue to shape the future of the industry, inspiring new generations of inventors and researchers to explore the potential of nanostructures and bonding technologies.

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