The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Aug. 27, 2021
Applicant:

Ag Materials Technology Co., Ltd., Hsinchu, TW;

Inventors:

Tung-Han Chuang, Hsinchu, TW;

Hsing-Hua Tsai, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/2745 (2013.01); H01L 2224/29007 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29541 (2013.01); H01L 2224/29582 (2013.01); H01L 2224/29666 (2013.01); H01L 2224/29671 (2013.01); H01L 2224/29684 (2013.01); H01L 2224/32147 (2013.01); H01L 2224/8383 (2013.01); H01L 2224/83895 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A bonding structure is provided, wherein the bonding structure includes a first substrate, a second substrate, a first adhesive layer, a second adhesive layer, and a silver feature. The second substrate is disposed opposite to the first substrate. The first adhesive layer is disposed on the first substrate. The second adhesive layer is disposed on the second substrate and opposite the first adhesive layer. The silver feature is disposed between the first adhesive layer and the second adhesive layer. The silver feature includes a silver nano-twinned structure that includes twin boundaries that are arranged in parallel. The parallel-arranged twin boundaries include 90% or more [111] crystal orientation.


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