Taipei, Taiwan

Tung-Han Chuang

USPTO Granted Patents = 13 

Average Co-Inventor Count = 2.0

ph-index = 4

Forward Citations = 71(Granted Patents)


Location History:

  • Tao-Yuan, TW (1995 - 1998)
  • Taichung, TW (2015)
  • Taipei, TW (1996 - 2018)

Company Filing History:


Years Active: 1995-2018

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13 patents (USPTO):Explore Patents

Title: Tung-Han Chuang: Innovator in Copper Alloys and Advanced Electronics

Introduction

Tung-Han Chuang is a prominent inventor based in Taipei, Taiwan, recognized for his extensive contributions to the field of material science and electrical engineering. With a remarkable portfolio of 13 patents, he has demonstrated a strong commitment to innovation, particularly in the development of advanced materials for electronic applications.

Latest Patents

Chuang's recent inventions include groundbreaking patents that reflect his expertise in materials technology. One of his latest patents is for a copper-based alloy wire, which is crafted from materials such as copper-gold, copper-palladium, and copper-gold-palladium alloys. This innovative wire features a polycrystalline structure with a face-centered cubic lattice, exhibiting a significant percentage of grains containing annealing twins, thus enhancing its properties.

Another noteworthy patent is for a stud bump structure and its manufacturing method. This structure includes a substrate and a first silver alloy stud bump, characterized by a specific weight percentage ratio of silver, gold, and palladium. These advancements open new possibilities in electronic packaging and enhance the performance of electronic components.

Career Highlights

Throughout his career, Tung-Han Chuang has made significant strides in his field, working for prestigious organizations, including the National Science Council. His work has not only advanced the understanding of alloy materials but has also contributed to practical applications in the electronics industry.

Collaborations

Chuang has collaborated with other notable researchers, such as Jun-Der Lee and Hsing-Hua Tsai. Their partnerships have facilitated the exploration of innovative ideas and the development of new technologies that address the challenges in material science and electronic engineering.

Conclusion

In summary, Tung-Han Chuang’s innovative spirit and dedication to research have resulted in numerous patents that advance the fields of material science and electronics. His work on copper-based alloys and electronic components continues to inspire future innovations and shapes the landscape of technology.

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