Other

National Science Council

Wire Technology Co., Ltd.

Industrial Technology Research Institute

China Steel Corporation

Tung-Han Chuang

Jun-Der Lee

Hsing-Hua Tsai

Ching-Bin Lin

Tao-Chih Chang

Jing-Yao Chang

Jing-Yi Huang

Jenn-Dong Hwang

Huey-Lin Hsieh

Chao-Chi Jain

Chun-Yen Lee

Chin-Ming Chiang

Jing-Shin Shyu

Jiin-Chyuan Chang

Teng-Chun Tsai

A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a polycrystalline structure of a face-centered cubic lattice and consists of a plurality of equi-axial grains. The quantity of grains having annealing twins is 10 percent or more of the total quantity of the grains of the copper-based alloy wire.

Copper-based alloy wire and methods for manufaturing the same

A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.

Stud bump structure and method for manufacturing the same

A stud bump structure, a package structure thereof and method of manufacturing the package structure are provided. The stud bump structure include a first chip; and a silver alloy stud bump disposed on the substrate, wherein the on-chip silver alloy stud bump includes Pd of 0.01&#x2dc;10 wt %, while the balance is Ag. The package structure further includes a substrate having an on-substrate bond pad electrically connected to the on-chip silver alloy stud bump by flip chip bonding.

Stud bump and package structure thereof and method of manufacturing the same

A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set. Thereafter, a solid-liquid interdiffusion jointing step is conducted to use a low melting-point metal layer to react with the high melting-point metal layer for producing an intermetallic compound layer jointing the thermoelectric element set with the metal electrode set, and the low melting-point metal layer is consumed completely.

Multi-layer thermoelectric module and method for fabricating the same

An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Alloy wire and methods for manufacturing the same

Provided are a dual-phase intermetallic interconnection structure and a fabricating method thereof. The dual-phase intermetallic interconnection structure includes a first intermetallic compound, a second intermetallic compound, a first solder layer, and a second solder layer. The second intermetallic compound covers and surrounds the first intermetallic compound. The first intermetallic compound and the second intermetallic compound contain different high-melting point metal. The first solder layer and the second solder layer are disposed at the opposite sides of the second intermetallic compound, respectively. The first intermetallic compound is adapted to fill the micropore defects generated during the formation of the second intermetallic compound.

Dual-phase intermetallic interconnection structure and method of fabricating the same

The present invention provides a novel process for making a radially arranged aluminum foil-filled plastic pellet for shielding against electromagnetic interference, comprising sandwiching a plastic matrix in between two layers of aluminum foil to form an aluminum/plastic/aluminum laminated sheet; slicing the laminated sheet into a plurality of aluminum/plastic/aluminum laminated strips; dividing the plurality of laminated strips into at least one group, each group containing 3 to 20 radially arranged strips; moisturizing and binding at least one group of laminated strips with a molten plastic matrix to form at least one radially arranged aluminum foil-filled plastic bar; and cutting at least one plastic bar into radially arranged aluminum foil-filled plastic pellets. By the present invention, the cost of making the conductive plastic pellets can be decreased, the amount of aluminum foil in the pellet can be greatly increased, and the breakage of the aluminum foil in the die can be prevented.

Process and apparatus for making radially arranged aluminum foil-filled plastic pellets to shield against electromagnetic interference

The present invention provides a process and apparatus for manufacturing an electromagnetic interference shielding metallic foil cladded plastic product. The process comprises (a) coating one side of a superplastic alloy plate with a coupling agent or a hot melt adhesive; (b) placing the coupling agent- or hot melt adhesive-coated superplastic alloy plate in a mold, and superplastically forming the superplastic alloy plate to a superplastic alloy foil with a predetermined shape, such that another side of the superplastic alloy foil is attached to the mold and the coupling agent- or hot melt adhesive-coated side of the superplastic alloy foil is spaced apart from the mold to form a mold cavity, wherein an injection machine is attached to the mold cavity, and wherein the injection machine is capable of injecting softened plastic into the mold cavity; (c) introducing softened plastic from the injection machine to the mold cavity, such that plastic adheres on the coupling agent- or hot melt adhesive-coated side of the superplastic alloy foil, and an electromagnetic interference shielding metallic foil cladded plastic product is formed; and (d) removing the plastic product from the mold. The final metallic plastic product can not only have as intricate a shape as an ordinary plastic product, but also has a shielding effectiveness as high as an ordinary metallic shield.

Process for manufacturing an electromagnetic interference shielding metallic foil cladded plastic product

The present invention provides a process for manufacturing an electromagnetic interference shielding metallic foil cladded plastic outer shell product. A first side of a superplastic alloy foil is coated with an adhesive and then the foil is placed foil in a first half mold to allow the foil to be initially superplastically formed. A second half mold attached to a nozzle of an injection machine is covered onto the first half mold, and the two half molds are closed to further deform superplastic alloy foil. Softened plastic is introduced from the injection machine to a mold cavity between the foil and the second half mold, such that the superplastic alloy foil covered on the first half mold is completely formed and the softened plastic adheres on the adhesive-coated side of the superplastic alloy foil to form an electromagnetic interference shielding metallic foil cladded plastic outer shell product. Two types of products can be obtained, that is, the superplastic alloy foil can be either the outer wall or inner wall. Moreover, the final metallic plastic product can not only have as intricate a shape as an ordinary plastic product, but also a shielding effectiveness as high as an ordinary metallic shield.

Process for manufacturing an electromagnetic interference shielding superplastic alloy foil cladded outer shell product

The present invention provides a superplastic alloy-containing conductive plastic article for shielding electromagnetic interference. The conductive plastic article is a three-layer structure, in which the outer layers are plastic material, and the inner layer is a superplastic alloy. The requirements for the raw materials are that the melting point of the superplastic alloy is higher than the softening point of the plastic, and the superplastic alloy has superplasticity at a temperature higher than the softening point of the plastic. The conductive plastic article can be manufactured in one processing stage, has the same shielding effectiveness as that of a conventional metal plate article, and can take a delicate and complicated form as that of a conventional plastic article. Moreover, the superplastic alloy contained therein has a uniform thickness and good adherence to plastic.

Superplastic alloy-containing conductive plastic article for shielding electromagnetic interference and process for manufacturing the same

The present invention provides novel kind of aluminum laminally filled plastic pellets and a process and apparatus for manufacturing the plastic pellets. The process includes coating the upper and lower surfaces of each of the substantially parallel lined aluminum foil layers with a coupling agent; drying the aluminum foil layers; introducing a molten plastic matrix to the space between each two aluminum foil layers and the outer surfaces of the most outside two aluminum foil layers to moisturize and bind the aluminum foil layers; reducing the thickness of the aluminum foil layers to form a continuous laminally filled plastic composite plate; and cooling and cutting the composite plate into aluminum laminally filled plastic pellets of a predetermined size. The aluminum contained in the plastic pellet maintains a high aspect ratio, therefore, reducing the loading amount of the aluminum required to provide good EMI shielding of the plastic pellets, while not adversely affeting the mechanical properties of the EMI plastic product.

Process and apparatus for manufacturing aluminum laminally filled

A process for making metallized plastic molding pellets comprising: first metallizing a laminated plastic sheet by sandwiching an electrically conductive metal foil in between two plastic films; secondly slicing the metallized laminated plastic sheet into a plurality of metallized plastic strips; thirdly wetting and binding the metallized plastic strips, which are radially arranged, with a thermoplastic resin matrix to form a metallized plastic bar by pultrusion processing; and finally cutting the pultruded metallized bar to obtain homogeneously metallized plastic pellets for making effective EMI shields.

Process for making metallized plastic molding pellets for shielding

A high gas pressure material capable of producing 50-300 psi gas pressure at forming temperature is placed in an enclosed area surrounding and sealing the blanks to be superplastically formed, without the use of argon gas. The blanks are formed under tensile stress by the internal pressure produced by the high gas pressure material. The method can be performed concurrently with diffusion bonding to obtain a metallic structure from a plurality of workpieces, and also can be used to manufacture perfectly spherical hollow bodies by a dieless method.

Growing community of inventors

Taipei, Taiwan

Tung-Han Chuang