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For the Inventor, By the Inventor

Taichung, Taiwan

Wire Technology Co., Ltd.


USPTO Granted Patents = 3

% Expired Patents = 100.0

Forward Citations = 3

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3 inventors (with patents filed for the assignee):

goldMedal Tung-Han Chuang (3 out of 13 patents)

silverMedal Jun-Der Lee (3 out of 6 patents)

bronzeMedal Hsing-Hua Tsai (3 out of 5 patents)


3 patents:

1. 9490147 - Stud bump structure and method for manufacturing the same (2016-11-08),
2. 9425168 - Stud bump and package structure thereof and method of manufacturing the same (2016-08-23),
3. 8940403 - Alloy wire and methods for manufacturing the same (2015-01-27),
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USPTO Data Jan 1 1976 - Oct 6 2026

3 Patents

#397 in Taichung

#3,307 in Taiwan

Taichung, TW
Taichung, Taiwan

Wire Technology Co., Ltd.

Forward Citations = 3

3 inventors:

goldMedal Tung-Han Chuang (3 out of 13 patents)

silverMedal Jun-Der Lee (3 out of 6 patents)

bronzeMedal Hsing-Hua Tsai (3 out of 5 patents)

Please report any incorrect information to [email protected]
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