Wire Technology Co., Ltd.

Calculating rank

USPTO Granted Patents = 3

% Expired Patents = 100.0

Forward Citations = 3

Loading Chart...

3 inventors (with patents filed for the assignee):

Tung-Han Chuang (3 out of 13 patents)

Jun-Der Lee (3 out of 6 patents)

Hsing-Hua Tsai (3 out of 5 patents)

3 patents: Sort by Forward Citations

1. 9490147 - Stud bump structure and method for manufacturing the same (2016-11-08),

2. 9425168 - Stud bump and package structure thereof and method of manufacturing the same (2016-08-23),

3. 8940403 - Alloy wire and methods for manufacturing the same (2015-01-27),

Company Badge

USPTO Data Jan 1 1976 - Nov 3 2026

3 Patents

#397 in Taichung

#3,317 in Taiwan

Taichung, Taiwan

Wire Technology Co., Ltd.

Forward Citations = 3

3 inventors:

Tung-Han Chuang (3 out of 13 patents)

Jun-Der Lee (3 out of 6 patents)

Hsing-Hua Tsai (3 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Wire Technology Co., Ltd.. Retrieved from https://idiyas.com/company/wire-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]