Jun-Der Lee

Title: Innovations of Jun-Der Lee: Pioneering Copper-Based Alloys

Introduction

Jun-Der Lee, an accomplished inventor based in Taichung, Taiwan, holds an impressive portfolio of six patents. His work primarily focuses on innovative materials and methods in the field of alloy manufacturing, showcasing his ability to blend scientific principles with practical applications.

Latest Patents

Among his latest contributions to the industry, Jun-Der Lee developed a copper-based alloy wire, which is composed of materials including copper-gold and copper-palladium alloys. This wire features a polycrystalline structure with a face-centered cubic lattice and is characterized by equi-axial grains. A notable aspect of this patent is the presence of annealing twins in at least 10 percent of the grains, enhancing the wire's properties for various applications.

Additionally, he introduced a stud bump structure that comprises a substrate and a first silver alloy stud bump with a specific weight percentage ratio of silver to gold to palladium (Ag:Au:Pd) ranging from 60-99.98:0.01-30:0.01-10. This innovative design caters to the growing demands of electronic packaging and microelectronics.

Career Highlights

Jun-Der Lee has demonstrated his expertise through his role at Wire Technology Co., Ltd., where he contributed significantly to research and development. His patents reflect deep technical knowledge and a commitment to advancing material science, earning him recognition within his field.

Collaborations

Throughout his career, Jun-Der has collaborated with talented professionals such as Hsing-Hua Tsai and Tung-Han Chuang. Working alongside these individuals has enabled him to combine diverse skill sets, fostering innovation and driving successful project outcomes.

Conclusion

Jun-Der Lee embodies the spirit of innovation through his pioneering work in copper-based alloys and manufacturing methods. His contributions significantly impact the field and present new opportunities for advancements in electronic applications. As he continues to explore new frontiers, his influence on material science is sure to grow alongside his impressive patent portfolio.