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Wire Technology Co., Ltd.

Jun-Der Lee

Tung-Han Chuang

Hsing-Hua Tsai

A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a polycrystalline structure of a face-centered cubic lattice and consists of a plurality of equi-axial grains. The quantity of grains having annealing twins is 10 percent or more of the total quantity of the grains of the copper-based alloy wire.

Copper-based alloy wire and methods for manufaturing the same

A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.

Stud bump structure and method for manufacturing the same

A stud bump structure, a package structure thereof and method of manufacturing the package structure are provided. The stud bump structure include a first chip; and a silver alloy stud bump disposed on the substrate, wherein the on-chip silver alloy stud bump includes Pd of 0.01&#x2dc;10 wt %, while the balance is Ag. The package structure further includes a substrate having an on-substrate bond pad electrically connected to the on-chip silver alloy stud bump by flip chip bonding.

Stud bump and package structure thereof and method of manufacturing the same

An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Alloy wire and methods for manufacturing the same

A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au&#x2014;Ag&#x2014;Pd alloy solution. The obtained Au&#x2014;Ag&#x2014;Pd alloy solution is drawn to obtain a Au&#x2014;Ag&#x2014;Pd alloy wire. The Au&#x2014;Ag&#x2014;Pd alloy wire is then drawn to obtain a Au&#x2014;Ag&#x2014;Pd alloy bonding wire with a predetermined diameter.

Composite alloy bonding wire and manufacturing method thereof

A manufacturing method for a composite alloy bonding wire is provided. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au&#x2014;Ag&#x2014;Pd alloy solution. The obtained Au&#x2014;Ag&#x2014;Pd alloy solution is drawn to obtain a Au&#x2014;Ag&#x2014;Pd alloy wire. The Au&#x2014;Ag&#x2014;Pd alloy wire is then drawn to obtain a Au&#x2014;Ag&#x2014;Pd alloy bonding wire with a predetermined diameter.

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Taichung, Taiwan

Jun-Der Lee