Tsutomu Mitani

This inventor holds 30 USPTO granted patents, primarily in Electronic Components. Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Corporation. Active years: 1987-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsutomu Mitani. Retrieved from https://idiyas.com/inventor/tsutomu-mitani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 66.7

Average Co-Inventor Count = 3.7

ph-index = 11

Forward Citations = 557(Granted Patents)

Location History:

Neyagawa, JP (1987 - 1989)
Osaka, JP (2003)
Akashi, JP (1992 - 2010)
Hyogo, JP (1999 - 2010)

Company Filing History:

28 out of 27,375

Matsushita Electric Industrial Co., Ltd.

patents

2 out of 16,454

Panasonic Corporation

patents

Years Active: 1987-2010

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Areas of Expertise:

Conductive Adhesive

Electronic Module

Semiconductor Device

Mounting Structure

Packaging Structure

Diamond-Like Carbon

Plasma CVD

Magnetic Recording Medium

Wiring Board

Repair Method

Manufacturing Process

Photosensitive Element

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7859855 - Module and mounted structure using the same (2010-12-28),

2. 7667974 - Module and mounted structure using the same (2010-02-23),

3. 7151306 - Electronic part, and electronic part mounting element and an process for manufacturing such the articles (2006-12-19),

4. 6853074 - Electronic part, an electronic part mounting element and a process for manufacturing such the articles (2005-02-08),

5. 6814893 - Conductive adhesive agent, packaging structure, and method for manufacturing the same structure (2004-11-09),

6. 6756663 - Semiconductor device including wiring board with three dimensional wiring pattern (2004-06-29),

7. 6749889 - Method for producing mounting structure for an electronic component (2004-06-15),

8. 6749774 - Conductive adhesive and connection structure using the same (2004-06-15),

9. 6675474 - Electronic component mounted member and repair method thereof (2004-01-13),

10. 6666994 - Conductive adhesive and packaging structure using the same (2003-12-23),

11. 6620345 - Conductive adhesive agent, packaging structure, and method for manufacturing the same structure (2003-09-16),

12. 6569512 - Mounting structure for an electronic component and method for producing the same (2003-05-27),

13. 6525414 - Semiconductor device including a wiring board and semiconductor elements mounted thereon (2003-02-25),

14. 6524721 - Conductive adhesive and packaging structure using the same (2003-02-25),

15. 6521144 - Conductive adhesive and connection structure using the same (2003-02-18),

Title: Tsutomu Mitani: Pioneering Inventor from Hyogo, Japan

Introduction: Tsutomu Mitani is a renowned inventor hailing from Hyogo, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Tsutomu Mitani holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Tsutomu Mitani has worked with leading research institutions and tech companies, developing cutting-edge solutions that have revolutionized industries worldwide.

Collaborations: Throughout his career, Tsutomu Mitani has collaborated with top engineers, scientists, and inventors, fostering a culture of innovation and knowledge-sharing that has led to significant advancements in the field of technology.

Conclusion: Tsutomu Mitani's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of inventions, inspiring future generations to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]