Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Tsutomu Mitani

Hiroaki Takezawa

Takashi Kitae

Yukihiro Ishimaru

Hideo Kurokawa

Hirokazu Nakaue

Yoshihiro Bessho

Tousaku Nishiyama

Taketoshi Yonezawa

Kazuo Eda

Minehiro Itagaki

Seiichi Nakatani

Yasuhiro Suzuki

Tsukasa Shiraishi

Kazuyoshi Amami

Kazufumi Yamaguchi

Mitsuo Asabe

Masaru Odagiri

Hideyuki Hashi

Kazuo Yokoyama

Hideaki Yoshio

Yuji Nakamura

A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module () includes a substrate () and a plurality of semiconductor packages (), each including a semiconductor chip (), mounted on the substrate (). Each of the plurality of semiconductor packages () includes a first radio communication element () for transmitting and receiving a signal between the semiconductor chips () in the plurality of semiconductor packages () by radio communication, and the first radio communication element () is constituted independently of the semiconductor chip ().

Module and mounted structure using the same

A surface of an external electrodeof an electronic partis formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit boardthrough the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrodeas a connecting element. Further, surface roughness (R) of an external electrodeof an electronic part is set to 0.1 &#x3bc;m or more and to 10.0 &#x3bc;m or less and preferably to 1.0 &#x3bc;m or more and to 5.0 &#x3bc;m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Electronic part, an electronic part mounting element and a process for manufacturing such the articles

A conductive adhesive agent of the invention contains an elution preventing film-forming agent , which becomes reactive after electric continuity through a conductive particle appeared in the conductive adhesive agent when a binder resin is being hardened, to thereby form an elution preventing film on a surface of the conductive particle . By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Conductive adhesive agent, packaging structure, and method for manufacturing the same structure

A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.

Semiconductor device including wiring board with three dimensional wiring pattern

A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.

Conductive adhesive and connection structure using the same

In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Method for producing mounting structure for an electronic component

An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100&deg; C. to 300&deg; C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.

Electronic component mounted member and repair method thereof

The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

Conductive adhesive and packaging structure using the same

A conductive adhesive agent of the invention contains an elution preventing film-forming agent which becomes reactive after electric continuity through a conductive particle appeared in the conductive adhesive agent when a binder resin is being hardened, to thereby form an elution preventing film on a surface of the conductive particle By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Mounting structure for an electronic component and method for producing the same

Semiconductor device including a wiring board and semiconductor elements mounted thereon

A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group; an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.

Growing community of inventors

Hyogo, Japan

Tsutomu Mitani