The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2006
Filed:
Dec. 13, 2004
Takashi Kitae, Osaka, JP;
Tsutomu Mitani, Hyogo, JP;
Yukihiro Ishimaru, Osaka, JP;
Hiroaki Takezawa, Nara, JP;
Takashi Kitae, Osaka, JP;
Tsutomu Mitani, Hyogo, JP;
Yukihiro Ishimaru, Osaka, JP;
Hiroaki Takezawa, Nara, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A surface of an external electrodeof an electronic partis formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit boardthrough the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrodeas a connecting element. Further, surface roughness (R) of an external electrodeof an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.