The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2010

Filed:

Jan. 04, 2010
Applicants:

Seiichi Nakatani, Osaka, JP;

Tsutomu Mitani, Hyogo, JP;

Inventors:

Seiichi Nakatani, Osaka, JP;

Tsutomu Mitani, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/06 (2006.01); H05K 7/08 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module () includes a substrate () and a plurality of semiconductor packages (), each including a semiconductor chip (), mounted on the substrate (). Each of the plurality of semiconductor packages () includes a first radio communication element () for transmitting and receiving a signal between the semiconductor chips () in the plurality of semiconductor packages () by radio communication, and the first radio communication element () is constituted independently of the semiconductor chip ().


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