Tsung-Pao Fang

Title: Tsung-Pao Fang: Innovator in Wafer Technology

Introduction

Tsung-Pao Fang is a notable inventor based in Milpitas, CA (US). He has made significant contributions to the field of wafer technology, holding a total of 3 patents. His work focuses on methods for identifying edges of care areas and determining defect criticality indices on wafers.

Latest Patents

Fang's latest patents include innovative methods for accurate identification of an edge of a care area for an array area formed on a wafer. These methods involve determining a value for a difference image based on position, allowing for precise identification of the edge of the care area. Additionally, he has developed methods and systems for determining a defect criticality index for defects on wafers. This computer-implemented method assesses critical area information surrounding defects detected by inspection systems, providing valuable insights into defect management.

Career Highlights

Throughout his career, Tsung-Pao Fang has worked with prominent companies in the technology sector, including Kla-Tencor Technologies Corporation and Kla Tencor Corporation. His experience in these organizations has allowed him to refine his expertise in wafer technology and contribute to advancements in the field.

Collaborations

Fang has collaborated with notable professionals in his field, including Chien-Huei (Adam) Chen and Xiaoming Wang. These collaborations have further enriched his work and contributed to the development of innovative solutions in wafer technology.

Conclusion

Tsung-Pao Fang's contributions to wafer technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of wafer defect management and identification.